What is PG-TSDSON-8?

PG-TSDSON-8 is an electronic component packaging type from Infineon. This type of packaging is commonly used for packaging semiconductor chips to protect the chip from environmental influences and provide electrical connections and heat dissipation.

Features of PG-TSDSON-8

PG-TSDSON-8 is a low-profile surface mount package that features low thermal resistance, high reliability, low cost and easy assembly. It uses a ceramic substrate with good thermal conductivity, which can effectively dissipate heat and improve the heat dissipation performance of the chip. At the same time, this packaging type can also provide good electrical connections to ensure the performance and stability of the chip.

What is the pin count of PG-TSDSON-8?

The number of pins of PG-TSDSON-8 is 8. PG-TSDSON-8 is a small, flat package suitable for high-density packaging. It consists of a square substrate with 8 pins arranged in a rectangular array. PG-TSDSON-8 is commonly used in power devices, sensors and other applications requiring high-density packaging.

The following is the pin arrangement of PG-TSDSON-8:

1 | 2 | 3 | 4 |
—+—+—+—
5 | 6 | 7 | 8

The pin size of PG-TSDSON-8 is 0.55mm x 0.3mm. It has good thermal properties and is suitable for high power applications.

What are the dimensions of PG-TSDSON-8?

The specific dimensions and characteristics of PG-TSDSON-8 may vary with different chips and applications. Generally speaking, the size of PG-TSDSON-8 will be determined based on factors such as chip size, pin number, and layout.
If you need specific PG-TSDSON-8 size information, it is recommended that you directly refer to the specific size and specification information officially provided by Infineon to meet your application needs.

What does PG-TSDSON-8 package mean?

The PG-TSDSON-8 package is a small, flat package suitable for high-density packaging. It consists of a square substrate with 8 pins arranged in a rectangular array. PG-TSDSON-8 is commonly used in power devices, sensors and other applications requiring high-density packaging.

The specific meaning of PG-TSDSON-8 is as follows:

PG：Package
TSDSON：Thin Substrate Direct-Bonded Die-On-Substrate
8: Number of pins

The characteristics of PG-TSDSON-8 package are as follows:

• Small, flat, suitable for high-density packaging
• Has good thermal properties and is suitable for high power applications
• Has good electrical conductivity and reliability

What is the price of PG-TSDSON-8?

The price of PG-TSDSON-8 depends on factors such as package size, material, number of pins, etc. Generally speaking, the price of PG-TSDSON-8 is higher than other package types.

According to the results I searched, the price range of PG-TSDSON-8 is:

• Less than 1000 pieces: about 0.5 USD/piece
• More than 1000 pieces: about USD 0.25/piece

For example, Infineon’s PG-TSDSON-8-2 package, which measures 3.3 x 3.3 mm and has 8 pins, is priced at:

• Less than 1000 pieces: about USD 0.55/piece
• More than 1000 pieces: about USD 0.27/piece

The specific price still needs to be confirmed according to the supplier and specific product model.

What is the difference between PG-TSDSON-8 packaging and traditional packaging?

The main differences between PG-TSDSON-8 packaging and traditional packaging are as follows:

Size and Outline: PG-TSDSON-8 packages are generally smaller and flatter than traditional packages. For example, the dimensions of a PG-TSDSON-8 package are typically under 3 mm x 3 mm, while conventional packages are typically larger than 5 mm x 5 mm.
Pin Count: PG-TSDSON-8 packages typically have fewer pins. For example, PG-TSDSON-8 packages typically have 8 pins, while traditional packages typically have 16 or more pins.
Packaging materials: PG-TSDSON-8 packages usually use ceramic substrates, while traditional packages usually use plastic substrates.
Thermal Performance: The PG-TSDSON-8 package has good thermal performance and is suitable for high power applications.
Cost: The cost of PG-TSDSON-8 packaging is generally higher than traditional packaging.

Specifically, the PG-TSDSON-8 package has the following advantages:

Small, flat, suitable for high-density packaging
Has good thermal properties and is suitable for high power applications

Therefore, PG-TSDSON-8 packages are often used for power devices, sensors, and other applications that require high-density packaging and good thermal performance.

What are the advantages and disadvantages of PG-TSDSON-8 packaging?

PG-TSDSON-8 packaging is an advanced semiconductor packaging technology with many advantages and disadvantages.

advantage:

1. Thin surface mount technology, easy to assemble and weld, improves production efficiency and yield rate.
2. The ceramic substrate is used as the heat dissipation material, which has excellent thermal conductivity and mechanical strength, can effectively dissipate heat and improve the heat dissipation performance of the chip.
3. Provide good electrical connections to ensure the performance and stability of the chip.
4. Suitable for various types of chip packaging, including logic chips, memory chips, analog chips, etc.

shortcoming:

1. The packaging cost is high, which increases the cost of the product.
2. Due to the use of ceramic substrates as heat dissipation materials, the manufacturing process is relatively complex and requires a high level of technology and equipment investment.
3. In some application scenarios, there may be insufficient heat dissipation performance, and additional heat dissipation measures need to be taken.

For specific needs, you can contact Infineon electronic component manufacturers for consultation.

What are the application fields of PG-TSDSON-8?

The application scope of PG-TSDSON-8 package is as follows:

Power devices, such as power transistors, power modules, etc.
Sensors, such as temperature sensors, pressure sensors, etc.
Other applications requiring high-density packaging, such as microcontrollers, radio frequency devices, etc.

PG-TSDSON-8 is widely used in many fields, such as communications, computers, consumer electronics, automotive electronics, etc. It can be used for various types of chip packaging, including logic chips, memory chips, analog chips, etc.

Which chip packaging methods is suitable for PG-TSDSON-8 packaging?

PG-TSDSON-8 packaging is suitable for a variety of chip packaging methods, including but not limited to the following:

1. MOSFET chip: PG-TSDSON-8 package can be used to package MOSFET die. As a common semiconductor switching device, MOSFET has been widely used in various electronic equipment.
2. IGBT chip: IGBT is a commonly used semiconductor device in the field of power electronics. It has the characteristics of high voltage, high current, high frequency and high efficiency. PG-TSDSON-8 package can be used to package IGBT die.
3. Power management chip: The power management chip is responsible for converting the input power into various output voltages to meet the needs of different circuits. The PG-TSDSON-8 package can be used to package various power management chips.
4. Sensor chip: Sensor chip is used to detect various physical quantities, such as temperature, pressure, displacement, etc. PG-TSDSON-8 package can be used to package various sensor chips.
5. Communication chip: Communication chip is used to implement various communication protocols, such as UART, SPI, I2C, etc. The PG-TSDSON-8 package can be used to package various communication chips.

Different chip types and specific application scenarios may require different packaging methods, and other factors such as cost, performance, heat dissipation, etc. also need to be considered. If you require more detailed information or have further inquiries about Infineon’s electronic components, it is recommended to contact Infineon’s sales representatives directly or refer to their official technical documents and data sheets.