What is the SOT23-6 Package and Function?
The Sot23-6 package is a compact surface mount packaging technology, and its function mainly depends on the type of components packaged inside, such as transistors, operational amplifiers, boost chips, etc.
With its miniaturized design, good heat dissipation performance and wide application fields, it realizes key functions such as signal amplification, control, and power management in electronic devices. It is an indispensable component packaging form in portable devices, automotive electronics, industrial control and consumer electronics.
Overview of Sot23-6 Package
The Sot23-6 package, full name Small Outline Transistor Package-6, is a miniaturized surface mount packaging technology. With its compact design, good heat dissipation performance and wide application fields, it occupies an important position in the field of electronic equipment manufacturing. The Sot23-6 package is particularly suitable for electronic devices with extremely high space requirements, such as smart phones, tablets, automotive electronic systems, industrial control equipment, and various consumer electronic products.
Features of Sot23-6 package
- Miniaturization: The Sot23-6 package has significantly reduced volume, usually measuring 2.9mm x 1.3mm, suitable for high-density installation. This miniaturization feature makes it particularly popular in portable electronic devices, helping to reduce the overall size and weight of the device.
- Good heat dissipation performance: Despite its small size, the Sot23-6 package can still maintain good heat dissipation performance through its unique design, ensuring that the internal components will not be damaged by overheating under long-term operation.
- Number of pins: The “6” in the Sot23-6 package represents its number of pins, that is, the package has 6 pins, which are used to connect to the external circuit to achieve signal transmission and power supply.
- Easy to install: As a surface mount package, the Sot23-6 package does not require manual soldering of pins during installation. Instead, the components are directly mounted on the circuit board through automated equipment, greatly improving production efficiency.
Functions of Sot23-6 package
The functions of Sot23-6 package mainly depend on the type of components packaged inside it. Since Sot23-6 package is widely used in various electronic components, such as transistors, operational amplifiers, boost chips, power-taking protocol chips, etc., its functions are also diverse.
The following are some typical application scenarios and their functions:
- Transistor: When the Sot23-6 package contains a transistor, it mainly plays the role of current amplification and switch control. Transistor is one of the basic components in electronic circuits and is widely used in various electronic devices.
- Operational amplifier: An operational amplifier is a circuit unit with a very high amplification factor, which usually contains multiple transistors and other components. When the Sot23-6 package contains an operational amplifier, it can realize multiple functions such as signal amplification, filtering, and comparison, and is an important component in analog and digital circuits.
- Boost chip: In applications such as mobile power supplies and wireless chargers, the boost chip in the Sot23-6 package can convert low voltage into high voltage output. For example, boost chips such as AH6910 and AH6911 use the Sot23-6 package, which can convert 3V or lower voltage to higher voltage output such as 5V, 12V, etc. to meet the power supply needs of different devices.
- Power-taking protocol chip: In fast charging protocols such as USB-PD, the power-taking protocol chip in the Sot23-6 package can realize communication with the charger and voltage regulation functions. For example, chips such as LDR6328A use the Sot23-6 package, which can automatically detect VCONN and simulate E-Mark chips, support multiple fast charging protocols and voltage gear outputs, and provide devices with fast and stable charging experience.
SOT23-6 package brand
SOT23-6 package is widely used in MOSFET, chips and other devices. Regarding SOT23-6 package brands, there are many well-known companies that produce and sell related products. The following are some major brands and their introductions:
E-components.GlobalBestShopping.COM
- Products: various SOT23-6 package power management chips, MOS tubes, voltage regulators
- Introduction: E-components.GlobalBestShopping.COM is a manufacturer specializing in the manufacture of various electronic components, including resistors (including potentiometers), capacitors, power management chips, voltage regulators, inductors, transformers, diodes, triodes, optoelectronic devices, electroacoustic devices, display devices, thyristors (controlled rectifiers), field effect transistors, IGBTs, MOSFETs, relays and reed switches, switches, fuses, crystal oscillators, connectors, various sensors, etc.
Its overall production system strictly implements ISO9001 international quality standards, has a number of electronic design and development technology patents and honorary titles, and has introduced a number of foreign advanced R&D equipment, mastering a number of electronic analysis, reliability design, material technology, electronic simulation and packaging core manufacturing technologies.
Shenzhen Weibi Semiconductor Co., Ltd.
- Product: VBsemi STT3423P SOT23-6 packaged MOS tube
- Introduction: The company is a company specializing in the manufacture of field effect tubes, medium and low voltage MOS (12V~250V), high voltage MOS (300V~1000V), super junction MOS (500V~900V) power field effect tubes (MOSFET). Its overall production system strictly implements ISO9001 international quality standards, has a number of patents and honorary titles, and has introduced a number of foreign advanced equipment, mastering a number of field effect tube core manufacturing technologies.
ChipSourceTek
- Product: CST6800B SOT23-6L package dual N-Mosfet
- Introduction: The CST6800B provided by ChipSourceTek is a dual N-channel fast switching Mosfet with 30V, 4.5A characteristics. It adopts advanced trench technology and design to provide excellent RDS(ON) with low gate charge. It can be used in various applications and has the characteristics of green device availability, ultra-low gate charge, and excellent Cdv/dt effect drop.
INJOINIC
- Product: IP2330 SOT23-6 package single-cell lithium battery synchronous switch buck charging chip
- Introduction: INJOINIC is a company focusing on power management chip design. Its IP2330 is a 5V input, single-cell lithium battery synchronous buck charging management chip. The chip integrates power MOS and adopts a synchronous switch architecture to effectively reduce the size of the overall solution, reduce BOM cost, and has multiple protections and high reliability.
Tower Micro
- Product: TMI3253S SOT23-6 packaged electronic component
- Introduction: TMI3253S of Tower Micro (or related brands) is an electronic component in SOT23-6 package. The specific characteristics and application areas may vary depending on the model. Shenzhen Beidong Technology Co., Ltd. and other distributors sell products of Tower Micro and other brands and provide professional technical support and services.
It should be noted that the above are only some examples of brands that use SOT23-6 packaging. There are many other electronic component brands on the market that provide similar products.
When choosing a brand, it is recommended to consider multiple factors such as specific needs, product performance, price, and after-sales service.
E-components.GlobalBestShopping.COM is a reliable electronic component distributor in China, with professional electronic component technology selection solutions and a reliable electronic component R&D and production team, providing large-scale electronic component supply to the world.
Application scenarios of Sot23-6 package
Due to the characteristics of miniaturization, good heat dissipation performance and a wide range of application fields, the Sot23-6 package has been widely used in various application scenarios:
- Portable electronic devices: such as smartphones, tablets, smart watches, etc. These devices have extremely high space requirements, and the miniaturization characteristics of the Sot23-6 package just meet this demand.
- Automotive electronics: In automotive electronic systems, components such as sensors and control units need to withstand high temperature changes and vibration environments. The Sot23-6 package performs well in these applications due to its good heat dissipation performance and stability.
- Industrial control: In industrial automation control systems, devices such as PLCs and servo drives require high reliability and stability. The Sot23-6 package provides reliable protection for these devices through its compact design and high-quality performance of internal components.
- Consumer electronics: Such as microcontrollers and power management chips in smart home products. These products have high requirements for cost and performance, and the Sot23-6 package reduces production costs and improves production efficiency through its miniaturization and easy installation.
Conclusion
In summary, the Sot23-6 package is a miniaturized, easy-to-install and versatile surface mount packaging technology. It is widely used in various electronic components and provides important support for the field of electronic equipment manufacturing.
With the continuous development and progress of electronic technology, the Sot23-6 package will continue to play its unique advantages and be widely used and developed in more fields.
Purchase SOT23-6 power chip
E-components.GlobalBestShopping.COM platform provides, SOT23-6 switching regulator, SOT23-6 power driver chip, SOT23-6 power management chip, SOT23-6 touch chip, SOT23-6 analog switch chip, etc.
E-components.GlobalBestShopping.COM is one of the top ten best electronic component distributors in China. We have electronic component R&D team, electronic design, SMD resistors, SMD capacitors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, inductors, potentiometers and other products.
We have long-term cooperation with electronic component manufacturers in Taiwan and mainland China to design and develop customized electronic components.
If you need electronic components in SOT23-6 package, please contact us and send us the latest electronic component BOM list. We will provide you with the best electronic component product selection solution.
FAQs
SOT23-6 is a package for electronic components. Its full name is Small Outline Transistor Package. It is a type of SOT23 series, specifically marked as -6, indicating that this package has 6 pins. The SOT23-6 package occupies an important position in the field of electronic equipment manufacturing due to its miniaturization, low cost, good heat dissipation performance and reliability. This package is widely used in various electronic components, such as transistors, operational amplifiers, etc. Due to its compact design and excellent performance, it is suitable for high-density installation, especially for application scenarios that require small size and good heat dissipation performance. In addition, electronic components packaged in SOT23-6 are usually used in power management chips in TV boxes. They have dual-channel LDO voltage regulator circuits, with a DC 12V input, a 5V output and a 3.3V output, which are suitable for various electronic devices and systems.
The Sot23-6 package is a miniaturized surface mount transistor package (Small Outline Transistor Package) with 6 pins, which is widely used in various electronic components such as transistors, operational amplifiers, etc. Its dimensions are 3.00mm × 1.70mm × 1.60mm, and the pin spacing is 1.90mm, which is suitable for high-density installation and low cost.
The Sot23-6 package has the following significant features:
Miniaturization: Compared with traditional packages, Sot23-6 significantly reduces the volume and is suitable for space-constrained application scenarios.
Low cost: Plastic encapsulation materials are used in the production process, and the cost is relatively low.
Good heat dissipation performance: Although it is small in size, it can effectively dissipate heat through reasonable design and is suitable for components that require heat dissipation.
Reliability: The structural design is stable and can withstand a certain degree of vibration and impact, ensuring reliability in complex environments.
Due to its unique advantages, Sot23-6 packages are widely used in many fields, including but not limited to:
Portable electronic devices: such as smartphones, tablets, etc., in devices with extremely high space requirements, the miniaturization characteristics of Sot23-6 are particularly prominent.
Automotive electronics: In automotive electronic systems, such as sensors, control units and other components, Sot23-6 packages can withstand high temperature changes and vibration environments.
Industrial control: In industrial automation control systems, such as PLCs, servo drives, etc., Sot23-6 packages provide reliability and stability guarantees.
Consumer electronics: such as microcontrollers and power management chips in smart home products.
When designing a circuit board using the Sot23-6 package, you need to pay attention to the following aspects:
Layout rationality: Make sure that the pin spacing and pad size are consistent with the actual package to avoid welding problems caused by improper layout.
Heat dissipation design: Although the Sot23-6 package has good heat dissipation performance, additional heat dissipation measures such as adding heat dissipation copper foil or heat sinks are still required in high-power applications.
Reliability test: After the design is completed, conduct sufficient reliability tests to ensure the stability and durability of components in complex environments.
Sot26 is actually an abbreviation of Sot23-6. There is no difference between the two in package form and number of pins. Both represent miniaturized transistor packages with 6 pins. Therefore, they have the same characteristics and advantages in terms of size, pin configuration and application areas. However, in different product manuals or materials, you may see different naming methods, but in essence they refer to the same package form.
Yes, the Sot23-6 package is very suitable for high-density mounting. Its small size (3.00mm × 1.70mm × 1.60mm) and tight pin pitch (1.90mm) make it possible to place more electronic components in a limited space, thereby improving the integration and space utilization of the circuit board. Therefore, in electronic devices that require high-density mounting, such as portable devices such as smartphones and tablets, the Sot23-6 package is an ideal choice.
