Today, China’s high-end semiconductor think tank Xinmo Research released the 2024 China Semiconductor Market and Industry Outlook Report.
The report predicts that in 2024, the chip industry in mainland China (note: the article only covers data from mainland China) will turn from a cyclical trough to growth, with an increase of 12%; it is expected that in 2024, mainland China’s wafer foundry market demand will generally recover to improve, with an increase of 9 %; Mainland China’s semiconductor equipment is expected to continue to grow in 2024, with an increase of 9.6%.
Specifically, in terms of the chip industry, the agency predicts that chip sales revenue in mainland China will increase by 12% in 2024, reaching US$61.4 billion.
From the perspective of China’s application market, the revenue of each application market in China will grow to varying degrees in 2024. Among them, the report predicts that the automotive-related IGBT chips and modules/SiC chips and modules, power ICs, MCUs, discrete devices and other chip markets will maintain growth. It is expected that China’s automotive chip revenue will increase by 21% in 2024, reaching US$8.6 billion; It is expected that photovoltaic cell output will grow at a rapid rate of 35% in 2024, and China’s industrial electronic chip revenue will increase by 19% in 2024, reaching US$11.1 billion; in 2024, mobile phone-related CIS, radio frequency front-end chips, power IC, discrete devices, wireless The demand and price of connectivity and other chips have recovered to a certain extent.
Mainland China’s communication chip market revenue is expected to increase by 8% in 2024, reaching US$16.6 billion; the total revenue of China’s consumer electronics-related IGBT modules, MCUs, power ICs, discrete devices, wireless connection and other chips is expected to increase in 2024 7%, reaching US$12.9 billion.
In addition, the report also predicts that PC production in mainland China will decline by 8% in 2024. However, driven by commercial and innovative markets such as data centers and servers, China’s computing market chip revenue is expected to increase by 5% in 2024, reaching 8.6 billion. Dollar.
In terms of the foundry industry, Xinmo Research predicts that the foundry market in mainland China will grow by 9% in 2024, reaching US$12.4 billion. Take the top two wafer foundry leaders in mainland China, SMIC and Shanghai Huahong Grace, as examples.
In 2024, as new energy vehicles and wind and solar storage maintain growth, and mobile phones and consumer electronics resume positive growth, only the PC market is not optimistic. The demand from mainland China’s chip design industry will usher in a new growth cycle. Driven by the growth of mainland China’s chip design industry, the wafer foundry industry will also resume growth. Since SMIC accounts for a large proportion of revenue in fields such as mobile phones and consumer electronics, quarterly revenue in 2024 is expected to rebound.
Since Shanghai Huahong Grace accounts for a large proportion of revenue in fields such as new energy vehicles and industry, although there are unfavorable factors such as slowing growth in these two fields and intensifying market competition due to the continued expansion of international and domestic power device production capacity, The penetration rate of domestic chips continues to increase, and quarterly revenue in the second half of 2024 is expected to return to positive growth.
“As major end markets resume growth, demand for chips increases, which in turn increases the capacity utilization rate of mainland China’s wafer foundry.
It is expected that in the wafer foundry industry in mainland China in 2024, the capacity utilization rate of 8-inch wafer fabs will increase to 90%, and the capacity utilization rate of 12-inch wafer fabs will increase to 78%. Looking at the capacity expansion of wafer foundry in mainland China, under the influence of the recovery of the terminal industry in 2024, the wafer foundry industry in mainland China is expected to increase its 12-inch production capacity by approximately 135,000 wafers per month in 2024. The new production capacity mainly comes from 12 inches and is concentrated in Shanghai and Guangdong. “Xinmo Research believes.
In terms of the equipment industry, the global equipment market will fall back to US$112.8 billion in 2023, a decrease of 4.5%; the report predicts a slight increase of 2% in 2024 to US$115 billion.
The reason is that on the one hand, the leading international wafer fabs plan to build more advanced process production lines; on the other hand, as the capacity utilization rate of the foundry market gradually comes out of the trough, the attitude of major global and domestic wafer fabs in expanding production will turn positive.
Data show that the scale of the semiconductor equipment market in mainland China will reach a record high of US$34.2 billion in 2023, an increase of 8%, and the global share will reach 30.3%; the report predicts that the scale of the semiconductor equipment market in mainland China will reach US$37.5 billion in 2024, an increase of 9.6%.
Xinmo Research believes that while the equipment market in other parts of the world has stagnated or even declined, the Chinese mainland market has become the main growth engine of the global semiconductor equipment market. On the one hand, the Chinese market share in the revenue of major equipment manufacturers has increased significantly; on the other hand, the revenue of domestic equipment manufacturers has increased significantly, and they mainly supply the domestic market.
The expansion momentum of domestic leading wafer fabs such as SMIC, Huahong, Changcun, and Changxin is still rapid. SMIC announced in its third quarter financial report of 2023 that it will increase its capital expenditure in 2023 to US$7.5 billion (mid-2022). Core International’s annual report stated that capital expenditures in 2023 will be roughly the same as in 2022 (approximately US$6.4 billion), an increase of 17.2%. Affected by the international environment, it is expected that mainland’s leading wafer fabs will be more active in expanding production in 2024.
In 2023, the overall revenue of domestic semiconductor equipment companies will increase by more than 17.6%, reaching 4 billion U.S. dollars, and the equipment localization rate will reach 11.7%; Xinmo Research predicts that the revenue of mainland China equipment manufacturers will further increase to 5.1 billion U.S. dollars in 2024, with the localization rate Reached 13.6%. Under the general trend of domestic substitution, domestic equipment manufacturers will accelerate their expansion from point breakthroughs to vertical and horizontal dimensions, and the equipment industry will enter a new stage of comprehensive and rapid development.
Today we discuss China’s chips and DUV lithography machines in 2024: needs, challenges and opportunities.
With the rapid development of China’s integrated circuit industry, the demand for DUV lithography machines is also growing.
As a key equipment for manufacturing high-end chips, DUV lithography machines are of great significance to improving China’s chip production capacity and quality. However, to meet this demand, China still needs to make efforts in many aspects.
The current situation and challenges of China’s chip industry
China’s integrated circuit industry has made significant progress in recent years, but still faces some challenges. Among them, insufficient supply of key equipment is an important issue.
As a necessary equipment for manufacturing advanced process chips, the supply of DUV lithography machines is restricted, resulting in limited chip production capacity in China. In addition, China still lags behind the international leading level in terms of high-end chip design and process technology, and needs to continuously improve its own strength.
DUV lithography machine is a necessary equipment for manufacturing process chips of 7 nanometers and below. With the rapid development of 5G, Internet of Things, artificial intelligence and other technologies, the demand for high-end chips continues to increase. As a key equipment for manufacturing high-end chips, DUV lithography machine has high technical threshold and strong market monopoly. It is the core link in the integrated circuit industry chain. Mastering DUV lithography machine technology is of great significance to improving the overall competitiveness of China’s chip industry.
China’s progress in the field of DUV lithography machines
Although China is still relatively weak in the field of DUV lithography machines, it has made some progress in recent years.
For example, Shanghai Microelectronics Equipment Co., Ltd. has successfully developed a 28-nanometer process DUV lithography machine and plans to launch more advanced models in the future.
In addition, the Chinese government is also increasing its support for the research and development of key equipment such as DUV lithography machines and encouraging companies to strengthen technological innovation and cooperation.
The future outlook of China’s chip industry
With the rapid development of 5G, Internet of Things, artificial intelligence and other fields, China’s chip industry will face more opportunities and challenges.
In the future, China needs to continue to increase investment in the integrated circuit industry, strengthen independent research and development and innovation, and break through bottlenecks in key equipment and technology. At the same time, international cooperation should be strengthened to jointly promote the healthy development of the global integrated circuit industry.
Policy recommendations and measures
In order to further promote the development of China’s chip industry, the Chinese government and enterprises need to adopt a series of policy measures.
First of all, the government should increase support for the integrated circuit industry, increase industry concentration, and cultivate leading companies with international competitiveness. Secondly, strengthen industry-university-research cooperation, promote the research and development of key equipment and technology, and break through technical bottlenecks.
In addition, we will strengthen talent training and introduction to provide sufficient talent support for industrial development. Finally, strengthen international cooperation and exchanges, actively participate in the formulation of international standards and industrial cooperation, and promote the coordinated development of the global integrated circuit industry.
China’s demand for DUV lithography machines in 2024
In 2024, China’s demand for DUV lithography machines will continue to grow, mainly due to technological progress and industrial expansion.
Market supply and demand and international trade environment
At present, the global DUV lithography machine market is mainly dominated by companies such as ASML of the Netherlands, Canon and Nikon of Japan.
These companies have strong capabilities in technology research and development, production and marketing, and occupy a considerable market share. As one of the world’s largest integrated circuit markets, China has a huge demand for DUV lithography machines.
However, due to the international trade environment and supply constraints, the domestic market is in short supply.
Therefore, China needs to seek more cooperation and exchanges in the international trade environment to promote the balance between supply and demand in the DUV lithography machine market.
Technology R&D and independent innovation
Mastering DUV lithography machine technology requires a high degree of independent innovation capabilities and technology accumulation.
China’s technology research and development in the field of integrated circuits started late, and there is a certain gap between China and the international leading level. In order to meet the demand for DUV lithography machines, China needs to increase investment in technology research and development and independent innovation, break through key technology bottlenecks, and improve independent research and development capabilities and industrial competitiveness.
At the same time, we will strengthen cooperation and exchanges with international advanced enterprises to jointly promote technological innovation and industrial development.
Talent training and introduction
The development of the integrated circuit industry cannot be separated from the support of high-quality talents. China’s talent pool in the integrated circuit field is relatively insufficient, especially in the high-end talent gap. In order to meet the demand for DUV lithography machines, China needs to increase investment in talent training and introduction, establish a complete talent training system, and attract and retain more high-end talents. At the same time, we will strengthen cooperation and exchanges with internationally renowned companies and universities to jointly cultivate and deliver outstanding talents.
Industrial chain collaboration and ecological construction
The application of DUV lithography machines involves the collaboration and ecological construction of the entire integrated circuit industry chain. China needs to strengthen cooperation and exchanges between upstream and downstream enterprises in the industrial chain and promote collaborative innovation and ecological construction in the industrial chain. Through policy guidance and market mechanisms, we will promote the deep integration and complementary advantages of all links in the industrial chain, and improve the competitiveness and stability of the entire industrial chain.
To sum up, China’s demand for DUV lithography machines will still be strong in 2024, and it will face both challenges and opportunities. The government and enterprises need to take effective measures from multiple perspectives to strengthen independent research and development and technological innovation, break through bottlenecks in key equipment and technology, and promote the healthy development and global competitiveness of the integrated circuit industry. At the same time, international cooperation and exchanges should be strengthened to jointly promote the coordinated development of the global integrated circuit industry.
Summarize
China’s chip industry faces many challenges and opportunities during its rapid development. DUV lithography machine is a key equipment for manufacturing high-end chips, and its supply and technology mastery are of great significance to the development of the industry.
The government and enterprises should increase investment, strengthen independent research and development and innovation, break through bottlenecks in key equipment and technology, and jointly promote the healthy development of China’s chip industry and enhance global competitiveness.
FAQs
Why does China need more DUV lithography machines?
With the rapid development of China’s integrated circuit industry, the demand for DUV lithography machines is growing day by day. DUV lithography machines are key equipment for manufacturing high-end chips and are crucial to improving China’s chip production capacity and quality.
What is the current technological status of China in the field of DUV lithography machines?
At present, China has made some progress in technological research and development in the field of DUV lithography machines, but there is still a gap between it and the international leading level. Mastering DUV lithography machine technology requires a high degree of independent innovation capabilities and technology accumulation.
How does China solve the problem of insufficient supply of DUV lithography machines?
China can break through key equipment and technical bottlenecks and improve the independent research and development capabilities and industrial competitiveness of DUV lithography machines by strengthening independent research and development and technological innovation. At the same time, we will strengthen cooperation and exchanges with international advanced enterprises to jointly promote technological innovation and industrial development.
How big will China’s demand for DUV lithography machines be in 2024?
Due to the rapid development of China’s integrated circuit industry, the demand for DUV lithography machines continues to grow. The specific demand needs to be comprehensively considered based on multiple factors such as market supply and demand, technological progress and industrial expansion.
What policies and measures does China have to meet the demand for DUV lithography machines?
The Chinese government can adopt a series of policy measures to meet the demand for DUV lithography machines. This includes increasing support for the integrated circuit industry, strengthening industry-university-research cooperation, strengthening talent training and introduction, and strengthening international cooperation and exchanges.
What challenges and opportunities does China have in meeting the demand for DUV lithography machines?
China faces some challenges and opportunities in meeting the demand for DUV lithography machines. Challenges mainly include the difficulty of technology research and development, insufficient equipment supply, and insufficient talent reserves. Opportunities lie in the growth of market demand brought about by technological progress and industrial expansion, as well as the government’s policy support for the integrated circuit industry.
Panoramic map of China’s automotive chip industry in 2024: covering automotive chip manufacturing, vehicle system manufacturing, vehicle instrument manufacturing, and vehicle manufacturing, highlighting the core role of automotive chips in intelligent driving and assisted driving systems.
The core data source of this article: China’s automotive chip market size; China’s automotive chip regional competition pattern; China’s automotive chip market supply
Chip Industry Overview
Definition
Automotive chips refer to semiconductor products used in car body automotive electronic control devices and vehicle-mounted automotive electronic control devices.
From an application perspective, cars as small as the tire pressure monitoring system TMPS and cameras, as large as vehicle controllers and autonomous driving domain controllers are all inseparable from a variety of chips.
In the automotive chip industry chain, the upstream generally refers to basic semiconductor materials (silicon wafers, photoresist, CMP polishing fluid, etc.), manufacturing equipment and wafer manufacturing processes (chip design, wafer foundry and packaging testing); the midstream generally refers to The automotive chip manufacturing process includes main control chips, memory chips, communication chips, power chips, etc.; the downstream includes automotive system manufacturing, automotive instrument manufacturing, and vehicle manufacturing.
In terms of manufacturers, the upstream includes semiconductor materials and equipment manufacturers, Foundry factories, packaging and testing factories, etc., such as Shin-Etsu, Shanghai Silicon Industry, Nanda Optoelectronics, AMAT, ASML, Northern Huachuang, TSMC, UMC, SMIC, ASE, Changchun Electronic Technology, Tongfu Microelectronics, etc.; midstream includes GPU, FPGA, ASIC, MCU, DSP and other chip design and manufacturing manufacturers, such as NVIDIA, AMD, Infineon, Renesas, NXP, Freescale, etc.; downstream It includes central control instruments, radar manufacturing, Internet of Vehicles systems, assisted driving, vehicle manufacturing and other manufacturers, such as Nippon Seiki, Bosch, Magna, Hongquan IoT, Zhongtian Anchi, Volkswagen, Toyota, Ford, General Motors, Tesla et al.
Industry development history
China’s automotive chip development is mainly divided into four stages: the first stage (before 1970), mainly based on traditional car audio speakers and ignition devices; the second stage (1970-1980), mainly based on power and braking systems Mainly, involving ABS, EPS, etc.; the third stage (1980-1990) mainly focuses on active safety products such as tire pressure monitoring, ESC, road monitoring; the fourth stage (2000-present) involves more and more drivers Assistance, smart cockpit, new energy and other systems.
Industry policy background
From 2017 to 2023, the national level has issued a series of guidance suggestions and supporting policies on the technical level and product quality of the automotive chip industry. At the same time, relevant key planning has been carried out for the standard system construction guidelines for the automotive chip industry. The specific content is summarized. as follows:
Industry development status
Market supply situation of China’s automotive chip industry
Representative manufacturers of automotive chips in China include Vail, Shengbang, GigaDevice, etc. Among them, Vail Co., Ltd. ranked first with 9.123 billion pieces, followed by Shengbang Co., Ltd. with a production of 4.965 billion pieces. Among them, the output of power chips and analog chips is relatively higher. As China’s automobiles rapidly develop toward electrification, intelligence, and connectivity, the demand for various types of automobile chips increases, and the output of automobile chip manufacturers will also increase accordingly.
Market demand status of China’s automotive chip industry
In 2022, Vail’s automotive chip sales ranked first with 9.697 billion units, followed by Shengbang with sales of 4.637 billion units. Among them, the sales of power chips and analog chips are relatively higher. As China’s automobiles rapidly develop toward electrification, intelligence, and connectivity, automobile manufacturers are increasing their technological research and development of various types of main control chips. Domestic automobile chip manufacturers will usher in good opportunities for development in the future.
China’s dependence on foreign automobile chips
At the China Electric Vehicles Forum of 100 People (2023) held in March 2023, the Institute of Market Economics of the Development Research Center of the State Council stated that my country’s external dependence on automotive chips is as high as 95%, the self-sufficiency rate of computing and control chips is less than 1%, and power and The self-sufficiency rate of memory chips is only 8%. To achieve domestic substitution in the field of automotive chips, it is necessary to strengthen the internal coordination and external circulation of the automobile and chip industries in the short term to create a good development environment and expectations for automobile manufacturing companies; in the long term, it is necessary to implement a support system for the development of the chip industry and promote the independence of the chip industry. Safe and controllable.
China’s automotive chip market size
From the perspective of my country’s automotive chip market, key system chips such as my country’s advanced sensors, in-vehicle networks, three electrical systems, chassis electronic controls, ADAS (Advanced Driving Assistance Systems), and autonomous driving are all monopolized by companies in developed countries, resulting in the chip cost of my country’s automobiles Fees have always been higher. According to data from the China Automotive Chip Industry Innovation Strategic Alliance, the cost of automotive chips in my country will be approximately US$534/car in 2021, and may reach US$600/car in 2022. Preliminary estimates indicate that my country’s automotive chip market may reach US$16.2 billion in 2022. Combining the current status of my country’s automotive chip industry and its development prospects, Qianzhan preliminarily estimates that the market size of China’s automotive chip industry may reach US$19.7 billion in 2023.
Industry competition landscape
Regional competition: The automotive chip industry focuses on Guangdong
According to Qichamao query data, China’s registered automotive chip companies are currently mainly distributed in coastal provinces such as Guangdong and Jiangsu. Among them, Guangdong Province has the highest number of automotive chip industry companies, reaching 1,207, and Jiangsu Province ranks second in the number of automotive chip industry companies. For 572 households.
Enterprise competition: International giants occupy the high-end market of the automotive chip industry At present, domestic companies with the ability to produce automotive chip products mainly include Wingtech Technology, Beijing Ingenics, Vail Co., Ltd., BYD Semiconductor and other companies, focusing on the mid-to-low-end market. In the high-end automotive chip market, such as automotive main control chips, high-end sensors and other fields, it is mainly concentrated in foreign companies such as NXP, Infineon, and STMicroelectronics.
Industry development prospects and trend forecasts
The technological innovation of future automotive chips includes three dimensions: chip material innovation, chip design innovation and manufacturing process innovation. In terms of material innovation, SiC power devices have great development potential in the field of new energy vehicles and are mainly used in main drive inverters, on-board charging systems OBC, on-board power converters DC/DC and off-board charging piles. Although China’s SiC development started lagging behind, it has achieved significant results. In terms of design innovation, chip design takes performance and security as the core goals and driving forces. In the face of increasingly large and complex automotive data, it is urgent to improve chip computing performance. Many chip manufacturers improve the overall computing efficiency of the chip through multiple integrated high-frequency cores. High-frequency and high-performance chips have become the mainstream of design. In terms of process innovation, the scale of information data is increasing day by day. Intelligent upgrades place higher requirements on the computing performance of vehicle-mounted computing control chips. At the same time, car sales are rising day by day, the amount of cores used in bicycles is growing, and large-scale mass production is helping to reduce costs and increase costs. The demand for efficiency continues to increase, prompting chip manufacturers to continue to pursue lower processes to achieve performance improvement and cost reduction.
China’s automotive chip market is growing rapidly
At present, China has made breakthroughs in the semiconductor field. Although it is still in a weak position in automotive-grade semiconductors, it is gradually realizing import substitution in home appliances, industry and other fields. In the field of automotive-grade IGBT, BYD has made a breakthrough.
Some of Star Semiconductor’s products are used in the field of new energy vehicles. These are signs of China’s breakthrough in automotive-grade semiconductors. In addition, domestic listed companies acquire and integrate major global semiconductor companies through capital operations, such as Wingtech Technology’s acquisition of Nexperia Semiconductor and Vail’s acquisition of OmniVision Technology.
Through mergers and acquisitions and organic development, China’s automotive-grade semiconductors are expected to achieve major breakthroughs and achieve import substitution. Relevant automotive semiconductor companies are expected to benefit deeply from the opportunities brought by import substitution and automotive electric intelligence to significantly increase the value of bicycle semiconductors. According to Bloomberg, 19 of the world’s 20 fastest-growing chip industry companies in recent years are from mainland China.
China is the region with the fastest growth rate and the largest market demand in the global automotive chip industry. Based on the market growth rate of China’s automotive chips in recent years, Qianzhan preliminarily estimates that the compound growth rate of my country’s automotive chip scale may reach 22% in the future, and is expected to reach 22% by 2029. China’s automotive chip transaction size is expected to reach US$65 billion in 2018, with an average annual compound growth rate of 22%.
For more detailed research and analysis on this industry, please see the “China Automotive Chip Industry Market Forecast and Investment Strategic Planning Analysis Report” by the Qianzhan Industry Research Institute.
At the same time, Qianzhan Industry Research Institute also provides solutions such as industrial big data, industrial research reports, industrial planning, park planning, industrial investment promotion, industrial maps, smart investment promotion systems, industry status certification, IPO consulting/funding feasibility study, IPO working paper consultation, etc. .
The conference focuses on the latest technology, market trends and industry dynamics of integrated circuit design, aiming to promote collaborative innovation and cross-border integration of the industry chain and help the vigorous development of my country’s integrated circuit industry.
Major research institutions believe that after the global semiconductor market reaches a cyclical low in 2023, there will be an overall recovery trend this year.
Gartner predicts that global semiconductor industry revenue will reach US$624 billion in 2024, a year-on-year increase of 16.8%. The storage industry, known as the “barometer” of the semiconductor industry, was the first to experience price increases in the fourth quarter of last year, which has continued into this year and is expected to rebound by 66.3%.
The driving force behind this is the new wave of AI detonated by generative artificial intelligence (AIGC) led by ChatGPT. High-tech companies in data centers, servers, cloud computing, large computing power chips, large models and other fields quickly followed up, forming a new global AI arms race, which directly drove the development of high-bandwidth memory (HBM), GPU and other AI computing power-related technologies. Chip growth.
PBOC Moves, Nvidia Chips | The China Open 01/09/2024
As consumer electronics such as PCs, mobile phones, and tablets continue to recover, the first year of AI PC begins, and the “new four modernizations” of automobiles enter the deep water area, what new changes will occur in the chip industry this year? How to seize the opportunity for recovery? How about upstream and downstream Form a better coordination mechanism?
The 2024 China Integrated Circuit Design Innovation Conference and the 4th IC Application Expo (ICDIA 2024) will be held at the Wuxi International Convention Center from September 25-27. As the top event in China’s IC design industry and electronic technology industry, ICDIA is committed to promoting the application of chips, IC components and systems, and demonstrating China’s core innovation achievements and technological progress.
ICDIA 2024 will focus on the outstanding Chinese chip and innovative applications and achievements, bring eye-catching cutting-edge innovation results to the audience, and display the chip picture of future technology.
With the theme of “Application Innovation, Creating a New Ecosystem”, this conference focuses on the two main lines of “chip industry ecology” and “application-enabled industry upgrading”, with six theme forums, multiple innovation releases and application docking, IC application Exhibition, market-oriented and product-centered to build a supply and demand communication platform for chip applications.
It is worth noting that four large-scale exhibitions on integrated circuit design, packaging and testing, equipment and components, and automotive electronics are gathered at the same time, with a total exhibition area of nearly 50,000 square meters and more than 100,000 professional visitors. It is the largest exhibition for global IC companies and electronic R&D It is the best platform for enterprises to display innovative technologies, explore business opportunities and promote trade cooperation.
Paying attention to innovative applications, promoting application implementation, building a supply and demand platform, and assisting the construction of the chip industry ecosystem are the original intention of ICDIA’s establishment and the characteristics of ICDIA.
Six major theme forums
Create a feast of cutting-edge technology
This conference features six major theme forums, including “Large Models and AI Large Computing Power Chips”, “Low Power Consumption and Embedded Design“, “RSIC-V and IP Applications”, “Chip Cloud and Data Security”, “Communications and Radio Frequency Technology”, “Innovation Release and Application Docking”.
“Low Power Consumption and Embedded Design” Forum
With the continuous deepening of urban informatization and industry intelligence, embedded technology has become one of the fastest growing and most widely used computer technologies in the information industry, and is widely used in consumer electronics, medical electronics, industrial control, and intelligent hardware. In other fields, data from the Ministry of Industry and Information Technology shows that my country’s embedded system software market size will reach 937.6 billion yuan in 2022, a year-on-year increase of 11.04%; it is expected that the embedded system software market size will exceed 1 trillion yuan in 2023.
As digital transformation penetrates into all walks of life and the development of artificial intelligence applications is promoted, low power consumption and high performance will become the core direction of the future development of embedded technology.
This “High Performance Low Power Consumption and Embedded Design” forum will focus on the development and innovative application results of embedded technology in the fields of artificial intelligence, smart terminals, Internet of Things, edge computing, industrial control, etc., and promote the ecological construction of software and hardware systems. Strengthen upstream and downstream communication and collaboration to jointly discuss the future development of embedded systems.
“Large Models and AI Big Computing Power Chips” Forum
The explosion of ChatGPT triggered a wave of generative artificial intelligence. Almost at the same time, major Internet high-tech companies were competing to deploy large-scale artificial intelligence model applications and promote the deeper development of artificial intelligence in various fields. In the future, artificial intelligence may change people’s lives. daily life.
With the advent of the era of large artificial intelligence models, the massive demand for computing power has led to arms races one after another in the fields of data centers, servers, and large computing power chips. Data shows that the global AI accelerated computing market will reach US$45 billion in 2023, and is expected to reach US$400 billion by 2027.
This “Large Models and AI Large Computing Power Chips” forum will focus on the development of various large models and the latest application results, AI large computing power chips, including but not limited to GPU, ASIC, CPU, FPGA, GPGPU, etc., aiming to explore The integrated development of large model applications and computing power chips, explores the requirements of different artificial intelligence applications for computing power chips, and the technological development of computing power chips in the post-Moore era including storage and calculation integration and other types of computing structures.
“Cloud on Chip and Data Security” Forum
In the past, most chip design companies focused on local computing power. However, driven by new generation information technologies such as artificial intelligence, 5G, supercomputing, and autonomous driving, chip design is becoming more and more complex, and manufacturing processes are becoming more and more advanced. , the cost has also increased, bringing considerable pressure and challenges to chip design and development.
The use of cloud computing is currently a way to solve the computing power gap faced by chip design and help small and medium-sized enterprises balance costs. Therefore, “chip on the cloud” is becoming a major trend in the chip design industry.
How to get to the cloud? What are the options? How to ensure costs? How to support the “elastic computing power” of chip design? How to ensure security in the semiconductor industry that is extremely sensitive to data?
This “Chip Cloud and Data Security” forum will discuss the above issues, focusing on the situation, difficulties and data security issues of the chip industry’s cloud migration, aiming to establish a communication bridge between the chip industry and cloud service providers, and help build a domestic cloud service ecosystem. Help chip companies find good solutions and make good use of cloud computing to conduct business.
“RISC-V and IP Application” Forum
Since the development of the open source reduced instruction set architecture RISC-V, more and more companies, schools, and scientific research institutes have joined in. RISC-V is more flexible than traditional instruction set architecture, compatible with a wide range of applications, and is mostly used in the field of intelligent Internet of Things. Today, many companies around the world are expanding the RISC-V ecosystem and core applications, covering image sensors, security management, artificial intelligence computing, etc.
Data shows that RISC-V revenue will reach US$800 million in 2023, nearly double the previous two years, and is expected to reach nearly US$1 billion in 2024. As more and more companies embrace the RISC-V ecosystem, they may be able to compete with ARM and x86 in the future.
The open source and open nature of RISC-V will help China break through Western restrictions and achieve independent control. But it is undeniable that RISC-V is still relatively new. Compared with the complete and mature ecology of ARM and x86, it also faces problems such as ecological fragmentation, lack of some features, and insufficient high-end application market.
This “RISC-V and IP Application” forum mainly focuses on the sharing of innovative results and cutting-edge technologies in RISC-V technology, ecological application construction, IP cores and development tools, etc., and discusses the difficulties and difficulties in building a RISC-V open source and open ecosystem. Challenges, current status and future development trends of domestic IP applications.
“Communications and Radio Frequency Technology” Forum
In recent years, as the penetration rate of 5G continues to increase, the value and importance of radio frequency front-end chips have become increasingly prominent in mobile terminals. The domestic RF front-end industry has developed vigorously under the wave of domestic substitution and the rise of domestic terminals.
Data shows that after years of development, many outstanding companies have emerged in my country in the fields of switches, PA, WIFI FEM, filters and other subdivisions, and the global market share of RF front-end companies has reached more than 10%.
From a global perspective, the top five leading RF front-end companies have a combined market share of up to 80%, and there is still a lot of room for domestic substitution. Although there are many domestic start-ups pouring into the radio frequency track, there are still “partiality” situations.
For example, filter products are mostly concentrated in the mid- to low-end, and there is a lack of high-end products.
The materials, processes and packaging and testing technologies involved in RF front-end chips are not simple. How to achieve high-end breakthroughs in specific fields is still a big test for domestic RF companies.
With the technological advancement of 6G and WIFI7, as well as the popularization and promotion of UWB (ultra-wide) applications, future communication technology innovations will also bring new applications and new needs.
This “Communications and Radio Frequency Technology” forum mainly focuses on cutting-edge communications and radio frequency technologies, discusses the opportunities and challenges that emerging communications technologies bring to radio frequency technology, as well as the development of my country’s radio frequency front-end chip and module industry, and shares the latest application results. Promote my country’s radio frequency industry to advance into high-end fields.
“Innovation Release and Application Docking” Forum
China has become the world’s largest electronic application market, with chip demand ranking first in the world. In order to accelerate the docking and promotion of upstream and downstream applications, ICDIA will select 30 chips with the most market potential based on more than 1,000 domestic chip companies collected in the “China Chip Product Catalog” (formerly China Chip Compilation) and organize roadshow releases and application docking , assisting upstream and downstream collaboration.
Chip innovation supports and leads technological innovation. “Innovation Release and Application Docking” will invite major electronic equipment companies, R&D institutions, and system manufacturers to participate. It will also invite experts, scholars, business representatives, etc. to provide suggestions for accelerating the development of the domestic chip industry.
Four major exhibitions gathered at the same time
IC Application Expo “New”
In addition to the ICDIA Summit Forum and thematic forums, the IC Application Exhibition, the 11th Automotive Electronics Innovation Conference and Exhibition (AEIF), the 5th Automotive Chip Supply and Demand Matchmaking Conference, and the 12th Semiconductor Equipment Annual Conference and Semiconductor Equipment were held concurrently. The display of core components (CSEAC 2024) is also exciting.
IC Application Exhibition (IC Expo)
IC Expo is the first professional boutique exhibition dedicated to chip innovation, software, system solutions and product applications. The exhibition is divided into three major exhibition areas: [Innovative Chinese Chip], [Automotive Electronics], and [Black Technology Application], focusing on IC design technology, artificial intelligence, intelligent terminals, Internet of Things, smart transportation, in-vehicle entertainment, health technology, sports technology, and smart technology. New products, new technologies, new scenarios, and new applications such as home furnishings.
AEIF 2024
This year’s 11th AEIF will focus on the innovative development of the domestic and foreign automotive semiconductor industry and explore automotive electronics technology paths and market trends. The forum held at the same time focused on topics such as the development of intelligent connected vehicles, automotive chip system design innovation, and new energy vehicle innovation. The “Domestic Automotive Chip Reliability Grading Catalog (2024)” will also be released at the meeting, and there will also be an automotive chip supply and demand matchmaking meeting Promote the docking of automotive chip production and research, production and demand, and industry and finance.
From September 25th to 27th, 2024, we will gather in Wuxi to discuss the chip industry ecology and application development. We look forward to your arrival!
About ICDIA
The China Integrated Circuit Design Innovation Conference (ICDIA) focuses on the ecological construction of the IC industry chain and is committed to promoting the application of chips in automobiles, communications, and consumer electronics. It is China’s first boutique exhibition focusing on IC design innovation and system applications.
Previous conferences have focused on displaying new products, new technologies, and new applications, focusing on promoting innovative IC products and application solutions in the fields of automotive electronics, artificial intelligence, consumer electronics, industrial control, communications, and the Internet of Things.
The conference includes 1 thousand-person summit forum, 6 theme forums, and 1 IC application exhibition, displaying the TOP 100 best Chinese chips and innovative black technologies, and promoting new products, new technologies, and new applications.
IC design companies from across the country, supply chain procurement centers of various brands of electronic manufacturers, and R&D teams of major technology companies gathered together to share chip innovation results and future applications, and to take the pulse of new trends, trends, and trends in electronic technology.
