Tag: Infineon electronic components

EiceDRIVER™ 1EDL8011 is a high-side gate driver from Infineon Technologies AG designed to enhance power management efficiency and safety in battery-powered applications.

Here is a detailed introduction to the product:

Product Overview

EiceDRIVER™ 1EDL8011 is a high-side gate driver designed for battery-powered applications such as motor drives and switch-mode power supplies (SMPS). It can quickly disconnect the module from the main power rail in the event of a module failure to protect the battery and system from damage. This driver is suitable for a variety of battery-powered devices such as cordless power tools, robots, e-bikes, vacuum cleaners, etc., providing a reliable power management solution for these devices.

Product Features

High Gate Current Capability:

• EiceDRIVER™ 1EDL8011 has high gate current capability to achieve fast turn-on and turn-off of high-side N-channel MOSFETs. This capability enables the driver to respond quickly and manage power effectively in battery-powered applications.

Integrated Charge Pump and External Capacitor:

• The driver consists of an integrated charge pump and an external capacitor, which provides strong startup capability. When the operating input voltage is low, the internal charge pump can automatically provide the required MOSFET gate voltage to ensure normal operation of the device.

Comprehensive Protection Functions:

• The EiceDRIVER™ 1EDL8011 has a variety of protection functions, including input voltage undervoltage lockout (UVLO) protection, overcurrent protection (OCP), adjustable current setting threshold, time delay, and safe startup mechanism. Together, these functions can quickly cut off power when a device fails to prevent further damage.
• Input voltage undervoltage lockout (UVLO) protection prevents the device from operating under dangerous conditions and ensures system safety.
• Overcurrent protection (OCP) prevents overcurrent conditions by monitoring current and setting thresholds to protect the circuit from damage.

Wide Operating Voltage Range:

• The driver operates over a wide voltage range of 8V to 125V, which allows it to be used flexibly in a variety of battery-powered applications. At the same time, the gate sink current is up to 1A, which enables efficient switching and improves power management efficiency.

Low Power Design:

• The EiceDRIVER™ 1EDL8011 has a low quiescent current of 1µA in shutdown mode, which helps reduce power consumption in sleep mode and extend battery life.

VDS Sensing Function:

• The driver has a VDS sensing function that can trigger overcurrent shutdown by monitoring the drain-to-source voltage of the disconnected MOSFET. This function enhances the protection capability of the device and improves the reliability of the system.

DSO-8 Package:

• The EiceDRIVER™ 1EDL8011 adopts the DSO-8 package, which is very suitable for space-constrained designs. It enables the driver to be flexibly used in miniaturized and integrated electronic devices to meet the space requirements of modern electronic devices.

Application Scenarios

The high-side gate driver features of the EiceDRIVER™ 1EDL8011 make it an ideal choice for a variety of battery-powered applications. Here are some typical application scenarios:

Cordless Power Tools:

• In cordless power tools, battery-powered motors require efficient and reliable gate drivers to manage power. The EiceDRIVER™ 1EDL8011 provides high gate current capability to ensure fast start-up and stable operation of the motor. At the same time, its comprehensive protection functions can also prevent the motor from being damaged in overload or short-circuit conditions.

Robots:

• Robotic systems usually contain multiple motors and sensors and require a stable power supply. The EiceDRIVER™ 1EDL8011 provides a wide operating voltage range and low power design to meet the power management needs of robotic systems. At the same time, its protection functions can also ensure that the robot operates safely in complex environments.

Electric Bicycles:

• In electric bicycles, battery-powered motors require efficient gate drivers to manage power to ensure rider comfort and safety. EiceDRIVER™ 1EDL8011 provides high gate current capability and comprehensive protection functions to ensure stable operation of e-bikes and long battery life.

Vacuum cleaner:

• The motor in a vacuum cleaner requires fast response and stable power supply to ensure the vacuuming effect. EiceDRIVER™ 1EDL8011 provides high gate current capability and low power consumption design to meet the power management needs of vacuum cleaners. At the same time, its protection function can also prevent the motor from being damaged in overload or short circuit conditions.

Technical Specifications and Performance Parameters

Here are the main technical specifications and performance parameters of EiceDRIVER™ 1EDL8011:

1. Operating voltage range: 8V to 125V
2. Gate sink current: up to 1A
3. Shutdown mode quiescent current: as low as 1µA
4. Package: DSO-8
5. Protection functions: input voltage undervoltage lockout (UVLO) protection, overcurrent protection (OCP), adjustable current setting threshold, time delay, safe startup mechanism, etc.
6. VDS sensing function: trigger overcurrent shutdown by monitoring the drain-to-source voltage of the disconnected MOSFET

Product advantages

High efficiency:

• EiceDRIVER™ 1EDL8011 has high gate current capability and low power consumption design, making power management in battery-powered applications more efficient. This helps to extend battery life and improve the overall performance of the device.

Reliability:

• The driver has comprehensive protection functions, including input voltage undervoltage lockout (UVLO) protection, overcurrent protection (OCP), etc., which can quickly cut off the power supply when the device fails to prevent further damage. This enhances the reliability of the device and extends the service life of the device.

Flexibility:

• The wide operating voltage range and DSO-8 package of EiceDRIVER™ 1EDL8011 enable it to be flexibly used in a variety of battery-powered applications. This flexibility meets the diverse needs of modern electronic devices for power management.

Easy to integrate:

• The package and design of the driver make it easy to integrate with other electronic devices, reducing the difficulty and cost of system integration.

Precautions for use

When using EiceDRIVER™ 1EDL8011, you need to pay attention to the following points:

Ensure correct connection:

• When connecting the driver, you need to ensure that all pins are connected correctly to avoid failure or damage due to incorrect connection.

Pay attention to the operating voltage range:

• When using the driver, you need to pay attention to its operating voltage range and ensure that the input voltage is within the allowable range to avoid damage caused by over- or under-voltage.

Reasonably configure protection parameters:

• According to specific application requirements, reasonably configure the protection parameters of the driver, such as over-current protection threshold, time delay, etc., to ensure that the device can be protected in time when a fault occurs.

Pay attention to heat dissipation:

• In high-power applications, you need to pay attention to heat dissipation and ensure that the operating temperature of the driver does not exceed its maximum allowable temperature to avoid damage caused by overheating.

Summary

EiceDRIVER™ 1EDL8011 is a high-side gate driver launched by Infineon Technologies AG with the advantages of high efficiency, reliability, flexibility and easy integration. It can provide a stable power management solution in a variety of battery-powered applications to protect the battery and system from damage. At the same time, the driver also has comprehensive protection functions, which can quickly cut off the power supply when a device fails to ensure the safety of the system. Therefore, EiceDRIVER™ 1EDL8011 is one of the ideal choices for battery-powered applications.

The above content has covered the main features, application scenarios, technical specifications and performance parameters, product advantages and usage precautions of EiceDRIVER™ 1EDL8011. I hope this information can help you better understand this high-side gate driver.

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EiceDRIVER™ 1EDL8011 FAQs

PG-TSDSON-8 is an electronic component packaging type from Infineon. This type of packaging is commonly used for packaging semiconductor chips to protect the chip from environmental influences and provide electrical connections and heat dissipation.

Features of PG-TSDSON-8

PG-TSDSON-8 is a low-profile surface mount package that features low thermal resistance, high reliability, low cost and easy assembly. It uses a ceramic substrate with good thermal conductivity, which can effectively dissipate heat and improve the heat dissipation performance of the chip. At the same time, this packaging type can also provide good electrical connections to ensure the performance and stability of the chip.

What is the pin count of PG-TSDSON-8?

The number of pins of PG-TSDSON-8 is 8. PG-TSDSON-8 is a small, flat package suitable for high-density packaging. It consists of a square substrate with 8 pins arranged in a rectangular array. PG-TSDSON-8 is commonly used in power devices, sensors and other applications requiring high-density packaging.

The following is the pin arrangement of PG-TSDSON-8:

1 | 2 | 3 | 4 |
—+—+—+—
5 | 6 | 7 | 8

The pin size of PG-TSDSON-8 is 0.55mm x 0.3mm. It has good thermal properties and is suitable for high power applications.

What are the dimensions of PG-TSDSON-8?

The specific dimensions and characteristics of PG-TSDSON-8 may vary with different chips and applications. Generally speaking, the size of PG-TSDSON-8 will be determined based on factors such as chip size, pin number, and layout.
If you need specific PG-TSDSON-8 size information, it is recommended that you directly refer to the specific size and specification information officially provided by Infineon to meet your application needs.

What does PG-TSDSON-8 package mean?

The PG-TSDSON-8 package is a small, flat package suitable for high-density packaging. It consists of a square substrate with 8 pins arranged in a rectangular array. PG-TSDSON-8 is commonly used in power devices, sensors and other applications requiring high-density packaging.

The specific meaning of PG-TSDSON-8 is as follows:

PG：Package
TSDSON：Thin Substrate Direct-Bonded Die-On-Substrate
8: Number of pins

The characteristics of PG-TSDSON-8 package are as follows:

• Small, flat, suitable for high-density packaging
• Has good thermal properties and is suitable for high power applications
• Has good electrical conductivity and reliability

What is the price of PG-TSDSON-8?

The price of PG-TSDSON-8 depends on factors such as package size, material, number of pins, etc. Generally speaking, the price of PG-TSDSON-8 is higher than other package types.

According to the results I searched, the price range of PG-TSDSON-8 is:

• Less than 1000 pieces: about 0.5 USD/piece
• More than 1000 pieces: about USD 0.25/piece

For example, Infineon’s PG-TSDSON-8-2 package, which measures 3.3 x 3.3 mm and has 8 pins, is priced at:

• Less than 1000 pieces: about USD 0.55/piece
• More than 1000 pieces: about USD 0.27/piece

The specific price still needs to be confirmed according to the supplier and specific product model.

What is the difference between PG-TSDSON-8 packaging and traditional packaging?

The main differences between PG-TSDSON-8 packaging and traditional packaging are as follows:

Size and Outline: PG-TSDSON-8 packages are generally smaller and flatter than traditional packages. For example, the dimensions of a PG-TSDSON-8 package are typically under 3 mm x 3 mm, while conventional packages are typically larger than 5 mm x 5 mm.
Pin Count: PG-TSDSON-8 packages typically have fewer pins. For example, PG-TSDSON-8 packages typically have 8 pins, while traditional packages typically have 16 or more pins.
Packaging materials: PG-TSDSON-8 packages usually use ceramic substrates, while traditional packages usually use plastic substrates.
Thermal Performance: The PG-TSDSON-8 package has good thermal performance and is suitable for high power applications.
Cost: The cost of PG-TSDSON-8 packaging is generally higher than traditional packaging.

Specifically, the PG-TSDSON-8 package has the following advantages:

Small, flat, suitable for high-density packaging
Has good thermal properties and is suitable for high power applications

Therefore, PG-TSDSON-8 packages are often used for power devices, sensors, and other applications that require high-density packaging and good thermal performance.

What are the advantages and disadvantages of PG-TSDSON-8 packaging?

PG-TSDSON-8 packaging is an advanced semiconductor packaging technology with many advantages and disadvantages.

advantage:

1. Thin surface mount technology, easy to assemble and weld, improves production efficiency and yield rate.
2. The ceramic substrate is used as the heat dissipation material, which has excellent thermal conductivity and mechanical strength, can effectively dissipate heat and improve the heat dissipation performance of the chip.
3. Provide good electrical connections to ensure the performance and stability of the chip.
4. Suitable for various types of chip packaging, including logic chips, memory chips, analog chips, etc.

shortcoming:

1. The packaging cost is high, which increases the cost of the product.
2. Due to the use of ceramic substrates as heat dissipation materials, the manufacturing process is relatively complex and requires a high level of technology and equipment investment.
3. In some application scenarios, there may be insufficient heat dissipation performance, and additional heat dissipation measures need to be taken.

For specific needs, you can contact Infineon electronic component manufacturers for consultation.

What are the application fields of PG-TSDSON-8?

The application scope of PG-TSDSON-8 package is as follows:

Power devices, such as power transistors, power modules, etc.
Sensors, such as temperature sensors, pressure sensors, etc.
Other applications requiring high-density packaging, such as microcontrollers, radio frequency devices, etc.

PG-TSDSON-8 is widely used in many fields, such as communications, computers, consumer electronics, automotive electronics, etc. It can be used for various types of chip packaging, including logic chips, memory chips, analog chips, etc.

Which chip packaging methods is suitable for PG-TSDSON-8 packaging?

PG-TSDSON-8 packaging is suitable for a variety of chip packaging methods, including but not limited to the following:

1. MOSFET chip: PG-TSDSON-8 package can be used to package MOSFET die. As a common semiconductor switching device, MOSFET has been widely used in various electronic equipment.
2. IGBT chip: IGBT is a commonly used semiconductor device in the field of power electronics. It has the characteristics of high voltage, high current, high frequency and high efficiency. PG-TSDSON-8 package can be used to package IGBT die.
3. Power management chip: The power management chip is responsible for converting the input power into various output voltages to meet the needs of different circuits. The PG-TSDSON-8 package can be used to package various power management chips.
4. Sensor chip: Sensor chip is used to detect various physical quantities, such as temperature, pressure, displacement, etc. PG-TSDSON-8 package can be used to package various sensor chips.
5. Communication chip: Communication chip is used to implement various communication protocols, such as UART, SPI, I2C, etc. The PG-TSDSON-8 package can be used to package various communication chips.

Different chip types and specific application scenarios may require different packaging methods, and other factors such as cost, performance, heat dissipation, etc. also need to be considered. If you require more detailed information or have further inquiries about Infineon’s electronic components, it is recommended to contact Infineon’s sales representatives directly or refer to their official technical documents and data sheets.

Infineon is the world’s leading semiconductor company, providing a wide range of electronic components in automotive, industrial, consumer electronics, power semiconductors, sensors, security chips, analog chips and other fields.

In 2024, Infineon released a number of the latest electronic component models, including:

Infineon automotive grade power semiconductor IGBT

For automotive grade IGBT, Infineon has launched a new generation of 750 V EDT2 IGBT, model AIKQ200N125CP2, in TO247Plus package, with a rated current of 200 A, higher power density, lower saturation voltage drop and better parallel performance. . It can be used in applications such as electric vehicle main inverters and DC link discharge switches.

Automotive grade IGBT discrete devices
Product range fully compliant with automotive grade standards, fully supporting all types of motors, generators and power stages
Infineon offers a wide range of AEC-Q101 compliant automotive IGBTs with voltages ranging from 600 to 1200 V and currents up to 160 A. They are designed for hybrid and electric vehicles. Their IGBTs and diodes are optimized for Provides optimal performance for applications from low to ultra-high switching frequencies. From D2 PAK and TO-247, to high-performance packages such as Super-TO-220 and Super-TO-247, this product series provides a wealth of packaging options to achieve higher currents through suitable packaging solutions. handling or creepage requirements, and benchmark performance.

AIKQ250N75CP2: 750 V high voltage discrete IGBT, rated current 250 A, in TO-247Plus package.

AIKQ350N75CP2: 750 V high voltage discrete IGBT, rated current 350 A, in TO-247Plus package.

IRF7480S: 600 V power MOSFET rated at 120 A in TO-263-3 package.

Power semiconductor MOSFET

ISL6228A, a 120-volt MOSFET rated at 20 amps, comes in a TO-220 package. It has higher switching speed, lower conduction loss and higher voltage withstand capability, and can be used in electric vehicle inverters, battery management systems and industrial applications.

Infineon Power MOSFET

Power MOSFET: Infineon has launched a new generation of 200 V CoolMOS Boost 7 IGBT in TO-247-3 package with a rated current of 70 A, which has higher efficiency, lower on-resistance and higher reliability.

Infineon motor control chip

Motor control chip: Infineon has launched a new generation of AURIX™ TC3A motor control chip, which uses a 64-bit TriCore core and supports CPU clock frequencies up to 100 MHz, with higher performance and flexibility.

Infineon sensors

Infineon has launched a new generation of Infineon XENSIV™ sensor series, including accelerometers, gyroscopes, magnetometers, pressure sensors, temperature sensors, etc., with higher performance, lower power consumption and higher integration.

Infineon Technologies XENSIV ™ BGT60TR13C Connected Sensor Kit
(Kit_CSK_BGT60TR13) is a fast prototype design platform for use cases based on Xensiv BGT60TR13C 60GHz radar sensor.

BGT60TR13C is a fully integrated millimeter Podopler movement sensor with an antenna and a single seal. The sensor kit also includes DPS368 atmospheric pressure sensors. DPS368 has the characteristics of high accuracy and low current consumption, which can measure pressure and temperature.
Infineon Technology XENSIV ™ BGT60TR13C IoT sensor kit includes compact Feather compatible wing plates and fast IoT connection development boards. The network sensor kit combines sensors and low-power dual-core PSOC ™ 62M microcontrollers and Bluetooth® and Wi-Fi® connection options in the software ecosystem provided by ModuStoolbox ™.

The model numbers are A1023 and A1024 respectively. These two products are introduced in detail below.

Infineon sensor A1023: This is a high-precision, low-noise pressure sensor in an LGA package. It has higher linearity, lower drift and higher reliability and can be used in applications such as electric vehicles, industrial automation and medical equipment.

Infineon sensor A1024: This is a high-precision, low-noise temperature sensor in an LGA package. It has higher linearity, lower drift and higher reliability and can be used in applications such as electric vehicles, industrial automation and medical equipment.

A11340-5: 36 GHz ultra-wideband radar sensor for ADAS and autonomous driving applications.

A11341-5: 77 GHz ultra-wideband radar sensor for ADAS and autonomous driving applications.

A11342-5: 24 GHz ultra-wideband radar sensor for ADAS and autonomous driving applications.

Infineon RF devices

TLE9080-2: 2.4 GHz RF power amplifier for Wi-Fi and Bluetooth applications.

TLE9081-2: 5.8 GHz RF power amplifier for Wi-Fi and Bluetooth applications.

TLE9082-2: 24 GHz RF power amplifier for Wi-Fi and Bluetooth applications.

Security chip OPTIGA TPM 2.0

OPTIGA TPM 2.0: This is a security chip in LGA package. It has higher security, lower power consumption and higher reliability and can be used in applications such as electric vehicles, industrial automation and the Internet of Things.

Infineon analog chip ADuM4160

ADuM4160, a multi-channel power supply monitor, comes in a QFN package. It offers greater flexibility, lower power consumption and higher reliability for applications such as electric vehicles, industrial automation and medical equipment.
These new products have improved performance, reliability and power consumption to meet the different needs of various applications.

Infineon microprocessor

Aurix TC477: 32-bit microcontroller based on TriCore core for automotive and industrial applications.

Aurix TC478: 64-bit microcontroller based on TriCore core for automotive and industrial applications.

XMC4700: 32-bit microcontroller based on Cortex-M4 core for industrial applications.

These latest electronic component models are designed to meet growing market demands and provide customers with higher performance, lower power consumption and more reliable solutions.

Infineon is a company focusing on the semiconductor field, producing various components, including IGBTs, power MOSFETs, HEMTs, DC-DC converters, gate drive ICs, AC-DC power converters, etc.

As for the specific information of Infineon’s latest component models, you can also obtain it by visiting Infineon’s official website or contacting their sales representatives. They can provide the product information, specifications, models and related technical support you need.

Please note that the latest component numbers may change over time, so it is best to contact Infineon directly for the most current and accurate information.